Electronics (ELEC)
Department of Electronics
ELEC 5504 [0.5 credit] (ELG 6354)
Analysis of High-Speed Electronic Packages and Interconnects
Introduction to modeling, simulation and optimization of high-speed VLSI packages; models for packages, interconnects and ground/power planes; lumped, distributed and EM models for interconnects; delay, crosstalk and switching noise; moment matching techniques; concurrent thermal/electrical analysis of IC packages and boards.Summer session: some of the courses listed in this Calendar are offered during the summer. Hours and scheduling for summer session courses will differ significantly from those reported in the fall/winter Calendar. To determine the scheduling and hours for summer session classes, consult the class schedule at central.carleton.ca
Not all courses listed are offered in a given year. For an up-to-date statement of course offerings for the current session and to determine the term of offering, consult the class schedule at central.carleton.ca
