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Graduate Calendar Archives: 1999 / 2000 |
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ElectronicsMackenzie Building 5170 Telephone: 520-5754 Fax: 520-5708 E-mail: gradinfo@doe.carleton.ca The DepartmentChair of the Department, J.S. Wight Associate Chair, Graduate Studies, D.J. Walkey In addition to University and Graduate Faculty regulations, all Engineering departments share common procedures that are described in Section 18 of the General Regulations (see p. 66). Programs of study and research leading to the master's and Ph.D. degrees in electrical engineering are offered through the Ottawa-Carleton Institute for Electrical and Computer Engineering. The Institute, established in 1983, combines the resources of Carleton University and the University of Ottawa. For further information, including admission and program requirements, see p. 152. The Department of Electronics is concerned with the fields of applied and physical electronics. Effort is strongest in four broad areas: computer-aided design for electronic circuits; physics and fabrication technology for solid-state electronic and photonic devices; VLSI and high-speed analog integrated circuits; and microwave and photonic subsystems and circuits. Specific areas of specialization include: Computer-Aided Circuit DesignDevelopment of hierarchical simulators for mixed analog/digital circuits; analysis and design of switched-capacitor networks; analysis and design of high speed circuits; optimization techniques; synthesis of VLSI circuits using both algorithmic and knowledge-based approaches; analysis and simulations of communications systems links; layout synthesis and module generation. Photonic DevicesWaveguides and holographic optical elements for optical interconnects; electro-optic modulators and switches; waveguides for sensing applications. Solid State DevicesFundamental semiconductor device physics; device design and novel device structures; device modelling for CAD; new fabrication processes; submicron and quantum effect devices; photovoltaics; semiconductor sensors and transducers. Integrated Circuit EngineeringDesign and development of linear and digital integrated circuits; fabrication processes and test techniques; MOS, bipolar and BiCMOS ICs; VLSI; computer-aided circuit design. Analog Signal ProcessingSwitched-capacitor filters, transversal filters, operational amplifiers and radio frequency functions in analog signal processing applications, particularly for integrated circuit realization. CircuitsActive filters; linear and nonlinear circuit design; computer-aided circuit design; phase-locked circuits, carriers and clock synchronizers; mixers, modulators and demodulators. Microwave ElectronicsMicrowave amplifiers, oscillators, modulators, frequency converters, phase-shifters; use of FET and bipolar transistors, Schottky barrier, varactor, step recovery and PIN diodes; design using finline, microstrip, stripline, coax, and waveguide; monolithic microwave ICs in GaAs; miniature hybrid microwave ICs. Communications and Radar ElectronicsCircuits for terrestrial and satellite communications; circuit implementation of digital modulation techniques; antenna and array design; communication channel characterization; optical communications circuits; radar transmitter and receiver design. Biomedical ElectronicsCochlear prosthesis. NSERC/BNR Chair in CADThe joint Natural Sciences and Engineering Research Council/Bell Northern Research Chairs in Computer-Aided Design are currently held by Dr. Michel Nakhla and Dr. Q.J. Zhang. This is part of a planned expansion of the department in the area of CAD for VLSI.CITOThe Department is part of the CITO (Communications and Information Technology of Ontario) Centre of Excellence. Current research areas of the Centre with major participation from the Department are: integrated services digital networks, mobile and portable wireless networks, VLSI in communications, and millimetre wave/optical antennas and circuits for personal communications.MicronetThe Department is a member, along with seven other Canadian universities and several major industrial organizations, of Micronet, the federally-sponsored network on Microelectronic Devices, Circuits and Systems for ULSI (ultra-large scale integration). Within the Department Micronet supports research on: device structures, modelling and fabrication processes for submicron CMOS and BiCMOS ICs; high-speed filters, phase detectors, A-to-D converters, frequency synthesizers and other circuit elements for silicon ICs operating at radio frequencies; analysis and optimization of interconnects for high-speed ICs; and automated generation of custom cells for VLSI design.Course OfferingsThe structure of the courses offered allows a well-integrated master's or Ph.D. program of study to be chosen that is appropriately related to the field of thesis research. Device- and integrated-circuit-oriented courses cover: fabrication, semiconductor device theory, semiconductor device design, integrated circuit design, and integrated circuit reliability. Circuit-oriented courses include: signal-processing electronics, micro-processor electronics, computer-aided circuit design, phase-locked circuits, filter circuits, RF and microwave circuits, antenna and array design. Systems-oriented courses cover: optical fibre communications and radar systems.IC Fabrication FacilitiesExcellent facilities are available for the fabrication of solid state devices and integrated circuits for research purposes. These include a class-100 clean room in which all basic processes required in silicon monolithic technology can be carried out. The clean room houses facilities for photomask generation and photolithography, modern diffusion furnaces, a rapid thermal annealer, low-pressure chemical vapour deposition systems, ECR and reactive ion etchers, e-beam, RF and magnetron sputtering systems for metal deposition, and a SEM. Equipment for thick film deposition, scribing, bonding, and automatic testing is also available. Comprehensive test facilities are available for IC characterization, including wafer probers, HP4145 Semiconductor Parameter Analyzers, and an automated C-V measurement station.Computing FacilitiesThe Department has excellent computing facilities for software development and circuit design for integrated circuits and microwave circuits. IC designs using synthesis, standard cells and layout are supported for fabrication through the Canadian Microelectronics Corporation or in-house. The graduate computer network consists of 90 SUN workstations and has access to the Internet. Industry standard software includes CADENCE, Mentor Graphics, SYNOPSYS, HSpice, ANACAD, VARILOG, SONNET, EESOF, SUPREM, SEDAN, MEDICI, MINIMOS, Franz COMMON Lisp, MATLAB, MATHEMATICA, FRAMEMAKER, and others. Measurement FacilitiesAdvanced instrumentation is available supporting automated testing of both analog and digital integrated circuits at frequencies up to 2 GHz. Low noise test facilities include a phase noise measurement system, dynamic signal analyzers, spectrum analyzers, network analyzers, arbitrary waveform generators, digital sampling oscilloscopes, digital data analyzers and generators, and RF frequency synthesizers, all of which may be controlled using the IEEE 488 interface. The Department has up-to-date facilities for circuit development and measurement at microwave frequencies ranging up to 22 GHz. There are also facilities for work at optical frequencies. Thin-film microwave integrated circuits can be fabricated in-house; there is provision for the fabrication of GaAs MMICs through foundry services. Special purpose microwave equipment includes automated network analyzers, spectrum analyzers and frequency synthesizers, and a complete microwave link analyzer. Data generators and error-detection equipment is available for work on digital communications. Industry standard software, such as SERENADE (SUPERCOMPACT, HARMONICA) and ACADEMY (TOUCHSTONE, LIBRA) is available for the computer-aided design and layout of microwave integrated circuits. The research laboratories maintain extensive collaboration with government and industrial research and development agencies in the Ottawa area. Graduate CoursesNot all of the following courses are offered in a given year. For an up-to-date statement of course offerings for 1999-2000, please consult the Registration Instructions and Class Schedule booklet published in the summer. F,W,S indicates term of offering. Courses offered in the fall and winter are followed by T. The number following the letter indicates the credit weight of the course: 1 denotes 0.5 credit, 2 denotes 1.0 credit. The courses offered by the Department of Electronics are as follows: Engineering 97.551F1 (ELG6351)Passive Microwave CircuitsPropagation in ferrites. Characteristics of planar transmission lines, stripline, micro-strip, coplanar lines, slotlines. Representation of discontinuities in transmission lines and waveguides. Scattering-matrix characterization of microwave junctions and discontinuities. Microwave network analysis. Design theory (including CAD), characteristics, and use of microwave components. Engineering 97.552F1 or W1 (ELG6352)Analog Integrated FiltersThe fundamentals and details of analog continuous-time and SAW filters. Comparison to switched-capacitor filters. Review of filter concepts, types of filters, approximations, transformations. Building blocks such as op amps, transconductance amplifiers, and gyrators. Design using cascaded second-order sections, multiple loop feedback and LC ladder simulations. Engineering 97.553 (ELG6353)Radio Frequency Integrated Circuit DesignIntegrated radio front-end component design.Overview of radio systems, frequency response, gain, noise, linearity, intermodulation, image rejection, impedance matching, stability, and power dissipation. Detailed design of low-noise amplifiers, mixers, oscillators and power amplifiers.Use of on-chip inductors and baluns.Process variations, parasitics, and packaging. Engineering 97.554F1 or W1 (ELG6354)Analysis of High-Speed Electronic Packages and InterconnectsIntroduction to modelling, simulation and optimization of high-speed VLSI packages; models for packages, interconnects and ground/power planes; lumped, distributed and EM models for interconnects; delay, crosstalk and switching noise; moment matching techniques; concurrent thermal/electrical analysis of IC packages and boards. Engineering 97.555F1 (ELG6355)Passive Circuit TheoryGeneral description of networks leading to matrix representations. Elements of matrix algebra as applied to networks. Properties of network functions; poles and zeros of driving point and transfer functions. Foster and Cauer canonic forms. Synthesis of lossless two-ports, single and double-terminated. Engineering 97.556W1 (ELG6356)Simulation and Optimization of Electronic CircuitsIntroduction to computer simulation and optimization of electrical circuits. Time- and frequency-domain formulations for sensitivity analysis and optimization. Optimization techniques for performance-, cost- and yield-driven design of electronic circuits. Optimization approaches to modelling and parameter extraction of active and passive elements. Engineering 97.557W1 (ELG6357)Active Circuit TheoryCharacterization of negative resistance one-port networks, signal generation and amplification. Active two-ports; y, z, h, k, chain and scattering parameters. Measurement of two-port parameters. Activity and passivity; reciprocity, non-reciprocity, and anti-reciprocity. Stability, inherent and conditional; power gain of conjugate and mismatched two-port amplifiers.Prerequisite: Engineering 97.555 or equivalent. Engineering 97.558F1 (ELG6358)Computer Methods for Analysis and Design of VLSI CircuitsFormulation of circuit equations. Sparse matrix techniques. Frequency and time-domain solutions. Relaxation techniques and timing analysis. Noise and distortion analysis. Transmission line effects. Interconnect analysis and crosstalk simulation. Numerical inversion techniques. Asymptotic waveform estimation. Mixed frequency/time domain techniques. Sensitivity analysis. Engineering 97.559F1 (ELG6359)Integrated Circuit TechnologySurvey of technology used in silicon VLSI integrated circuit fabrication. Crystal growth and crystal defects, oxidation, diffusion, ion implantation and annealing, gettering, CVD, etching, materials for metallization and contacting, and photolithography. Structures and fabrication techniques required for submicron MOSFETs. Applications in advanced CMOS processes. Engineering 97.560F1 or W1 (ELG6360)Digital Integrated Circuit TestingProduction testing of digital integrated circuits. Outline of methods of testing used in production. Testing schemes and design for testability. Faults and fault models, yield estimates, testability measures, fault simulation, test generation methods, sequential testing, scan design, boundary scan, built-in self test, CMOS testing. Engineering 97.562W1 (ELG6362)
Microwave Semiconductor Devices and
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